Combined RF and digital/DC signalling interconnect laminate
US5384555A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 1993 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Jan 26, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An interconnect laminate structure integrates RF and auxiliary (e.g. digital and D.C.) signalling capabilities in a common structure by means of a stacked conductor-plated dielectric configuration that facilitates access to and routing by channelline/waffleline RF transmission links and separate control (e.g. digital, power supply) links, without having to perform laborious manual routing tasks to effect auxiliary connectivity among the components of a network. The interconnect structure includes a first dielectric layer having a channel formed in a first surface thereof, the channel having a conductive surface and configured to accommodate the insertion of a dielectric coated conductor into the channel so as to form an RF transmission line. Second dielectric layers, each of which has a conductive layer formed on a first surface thereof, are mounted together with the first dielectric layer in a laminate assembly. Respective layers of adhesive are interleaved with the plurality of second dielectric layers together with the first dielectric layer in a laminate assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.