Integrated circuit chip including superimposed upper and lower printed circuit boards
US5384689A · kind A · utility
Inventor
Key dates
| Filing date | Dec 20, 1993 |
| Grant date | Jan 24, 1995 |
| Priority date | — |
| Expiry date | Dec 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit chip includes a printed circuit board unit, a die and a plurality of conductive wires. The printed circuit board unit has a top surface, a plurality of conductive strips that is provided on the top surface, and a die-receiving cavity that is formed therewith. The cavity is accessible via the top surface. The die has an upper surface and a plurality of solder pads that is formed on the upper surface. The die is received in the die-receiving cavity of the printed circuit board unit such that the solder pads are exposed at the top surface of the printed circuit board unit. The conductive wires interconnect the solder pads of the die and the conductive strips of the printed circuit board unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.