Adhesive of amine-terminated polyamide and epoxy resin
US5385986A · kind A · utility
17Cited by
29References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 5, 1994 |
| Grant date | Jan 31, 1995 |
| Priority date | — |
| Expiry date | May 5, 2014 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot-melt adhesive composition is prepared from (1) a thermoplastic amine-terminated piperazine containing polyamide resin derived from (a) a polymerized fatty acid, (b) an aliphatic polyamine, and (c) a piperazine-containing polyamine without primary amine groups and/or a polyetherdiamine, optionally with (d) a linear dicarboxylic acid and/or a monocarboxylic acid; and (2) an epoxy resin; wherein the epoxy:amine ratio is greater than about 1:1 to less than about 10:1.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.