Structural adhesive composition having high temperature resistance
US5385990A · kind A · utility
14Cited by
17References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 1992 |
| Grant date | Jan 31, 1995 |
| Priority date | — |
| Expiry date | Nov 2, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G59/621
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A structural adhesive composition containing an epoxy compound, an amine hardener and a hydroxy-substituted aromatic compound having a pKa ranging from about 5 to 9.7 and a boiling point greater than about 210.degree. C. The utilization of a hydroxy-substituted aromatic compound having a pKa and a boiling point within the stated ranges provides for an adhesive composition which develops significant green strength, undergoes minimal sinkage during the bonding and curing process, and is capable of withstanding high temperature conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.