Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
US5386341A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 1993 |
| Grant date | Jan 31, 1995 |
| Priority date | — |
| Expiry date | Nov 1, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Semiconductor carrier assemblies (10, 40) use a flexible substrate (11) to connect to at least one semiconductor device (19). Preferably the flexible substrate (11) also connects to a circuit component, preferably a circuit board (31). The flexible substrate (11) is configured in a U-shaped configuration having at least one rigidizer plate (25; 41, 42) positioned in the notch of the U. Interconnections between the semiconductor device (19) and the flexible substrate (11), and, preferably, the circuit component (31) are provided by solder connections (22, 28). Preferably, two rigidizer plates (41,42) having different temperature coefficients of expansion are positioned in the notch of the U of the flexible substrate (11) and preferably a low modulus adhesive layer (50, 51, 47) is utilized in the assembly to minimize thermal stress.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.