Process for manufacturing a multi-chip module
US5386623A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Nov 7, 1991 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Nov 7, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4979
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A multi-chip module and a process for manufacturing the same comprises at least first and second semiconductor chips each formed with a plurality of semiconductor elements on their circuit forming surfaces and having different functions, mounted on a substrate. An insulating film is formed over the circuit forming surfaces of the first and second semiconductor chips. First and second connecting holes are formed in the insulating film over the circuit forming surfaces of the first and second semiconductor chips, respectively. A wiring layer is formed across the first and second connection holes so as to connect the first and second semiconductor chips electrically.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.