Tab type IC assembling method and an IC assembled thereby
US5386625A · kind A · utility
7Cited by
23References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 9, 1994 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Mar 9, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49135
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of assembling an integrated circuit (IC) by a TAB (Tape Automated Bonding) system, and an IC assembled thereby. Leads extending from a TAB tape and connected to an IC are each partly reduced in width. Hence, even when the end portions of the leads are deformed by some object by accident, it is not necessary to correct the shape of the leads since such end portions will be eventually cut off and discarded in the event of packaging of the IC.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.