Fabrication of ink fill slots in thermal ink-jet printheads utilizing chemical micromachining
US5387314A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 25, 1993 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Jan 25, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An ink fill slot can be precisely manufactured in a substrate utilizing photolithographic techniques with chemical etching, plasma etching, or a combination thereof. These methods may be used in conjunction with laser ablation, mechanical abrasion, or electromechanical machining to remove additional substrate material in desired areas. The ink fill slots are appropriately configured to provide the requisite volume of ink at increasingly higher frequency of operation of the printhead by means of an extended portion that results in a reduced shelf length and thus reduced fluid impedance imparted to the ink. The extended portion is precisely etched to controllably align it with other elements of the printhead.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.