Patent · US Expired

Metal-ceramic joint

US5387441A · kind A · utility

3Cited by

4References

5Claims

0Family size

Assignee

Hoechst Ceramtec AG · DE

Inventors

Tha Do-Thoi · Westerburg, DE
Peter Stingl · Achern, DE

Key dates

Filing date	Apr 3, 1992
Grant date	Feb 7, 1995
Priority date	—
Expiry date	Apr 3, 2012

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC04B2237/72
WIPO fieldMaterials, metallurgy
WIPO sectorChemistry

Abstract

A process is described for electrolessly depositing or electrodepositing a solder layer composed of copper and silver and having an overall composition of silver/copper of from 75:25 to 70:30 and a total layer thickness of 15 to 100 .mu.m on a metallized ceramic. In this process, copper layers and silver layers are deposited alternately on the metallized ceramic. The number of layers is at least 3 and the individual layer thickness is 5 to 10 .mu.m.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.