High dielectric constant coatings
US5387480A · kind A · utility
43Cited by
7References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 9, 1993 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Aug 9, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D89/00
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Disclosed is a method of forming high dielectric constant coatings on substrates. The method comprises applying a coating of hydrogen silsesquioxane resin and a high dielectric constant filler onto a substrate and heating the coated substrate at a temperature sufficient to convert the hydrogen silsesquioxane resin to a silica containing ceramic matrix containing the filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.