Patent · US Expired

Radiation-polymerizable mixture and process for producing a solder resist mask

US5387486A · kind A · utility

2Cited by

5References

1Claims

0Family size

Assignee

Morton International, Inc. · US

Inventors

Michael Emmelius · Mainz, DE
Walter Herwig · Bad Soden, DE
Kurt Erbes · Frankenthal (Pfalz), DE
Rudolf Decker · Bodenheim, DE

Key dates

Filing date	Oct 27, 1993
Grant date	Feb 7, 1995
Priority date	—
Expiry date	Oct 27, 2013

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S430/136
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to a radiation-polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80.degree. to 150.degree. C. to form a stencil which is resistant under soldering conditions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.