Sequential multilayer process for using fluorinated hydrocarbons as a dielectric
US5387495A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 1992 |
| Grant date | Feb 7, 1995 |
| Priority date | — |
| Expiry date | Apr 6, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0733
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a multilayer circuit board is disclosed which includes a build-up process in which, beginning with a solidified layer of the dielectric disposed upon a substrate, alternate layers of conducting metal and dielectric are sequentially deposited. Each layer of conducting metal lines is defined using photoresist and a photolithographic technique. After the lines are deposited, the photoresist is removed and a second layer of photoresist defines the conductive posts which function as through holes between metal layers. After each layer of conductive line and posts is formed, and the photoresist is removed, the dielectric is flowed into place and solidified to insulate adjacent metal lines and posts. The process may be repeated as many times as necessary to build up layers of conducting metal and dielectric, and form the completed multilayer wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.