Method for bonding substrates using molten moisture reactive organosiloxane compositions
US5389170A · kind A · utility
13Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1993 |
| Grant date | Feb 14, 1995 |
| Priority date | — |
| Expiry date | Jun 11, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L83/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Curable adhesive compositions comprise combinations of organosiloxane MQ resins and liquid polyorganosiloxanes of specified viscosity and functionality. The compositions are substantially free of unreactive materials and are applied in the molten state. Depending upon the concentration of reactive groups on the resin and polyorganosiloxane, the compositions may also include a silane containing an average of more than two hydrolyzable groups per molecule. Preferred compositions develop excellent adhesion to a variety of organic and metallic substrates during curing under ambient conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.