Method for making a diamond/carbon/carbon composite useful as an integral dielectric heat sink
US5389400A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1993 |
| Grant date | Feb 14, 1995 |
| Priority date | — |
| Expiry date | Apr 7, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method for producing a diamond/carbon/carbon composite is provided which includes the steps of densifying a preform of interwoven vapor grown carbon fibers form a carbon/carbon composite, and then depositing a polycrystalline diamond film on the carbon/carbon composite. The preform may be densified by depositing pyrolyric carbon into the interstices of the preform, either by a chemical vapor infiltration process or by a pitch infiltration process. The polycrystalline diamond film is deposited on the carbon/carbon composite by a microwave plasma enhanced chemical vapor deposition process. The resulting diamond/carbon/carbon composite can be utilized as an integral dielectric heat sink by depositing metallic circuits on the diamond layer of the diamond/carbon/carbon composite.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.