Processes and compositions for electroless metallization
US5389496A · kind A · utility
44Cited by
15References
35Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | May 17, 1993 |
| Grant date | Feb 14, 1995 |
| Priority date | — |
| Expiry date | May 17, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31536
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods and compositions for electroless metallization. In one aspect, the invention is characterized by the use of chemical groups capable of ligating with an electroless metallization catalyst, including use of ligating groups that are chemically bound to the substrate. In a preferred aspect, the invention provides a means for selective metallization without the use of a conventional photoresist patterning sequence, enabling fabrication of high resolution metal patterns in a direct and convenient manner.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.