Laser process apparatus for forming holes in a workpiece
US5389954A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 1991 |
| Grant date | Feb 14, 1995 |
| Priority date | — |
| Expiry date | Nov 19, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/1634
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In a laser process apparatus, a plurality of holes each having a predetermined shape are formed in a work upon radiation of light from an excimer laser. The apparatus is provided with a mask, in which a plurality of predetermined small holes are formed in correspondence with the plurality of holes to be formed in the work, and which allows laser light from the excimer laser to pass through the small holes thereof toward the work, a projection optical system for projecting optical images each having a predetermined shape onto the work through the small holes of the mask, a measurement optical system for measuring a work position, and a moving stage for moving the work on the basis of a measurement result form the measurement optical system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.