Metallization compositions for BI and PB-containing ceramic dielectrics
US5391223A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 20, 1993 |
| Grant date | Feb 21, 1995 |
| Priority date | — |
| Expiry date | Aug 20, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC04B41/88
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
It has been newly determined that in a reaction of an Ag/Pd metallization with Pb from a lead-based ceramics, a maximum solubility of Pb is observed of approximately 14% (atomic percent). By inclusion of an effective amount of Pb in the Ag/Pd metallization, leaching of Pb from a Pb-based ceramic is either reduced or eliminated. Thus, upon firing, the metallization exhibits an equilibration which prevents Pb from being drawn out of the underlying ceramic. Similarly, Ag/Pd metallization shows a maximum solubility of 16 atomic percent for Bi in Bi-based ceramics. Inclusion of an effective amount of Bi in the metallization prevents a Bi leaching from an underlying ceramic.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.