Leadframe adapted to support semiconductor elements
US5391439A · kind A · utility
191Cited by
6References
11Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 4, 1994 |
| Grant date | Feb 21, 1995 |
| Priority date | — |
| Expiry date | Feb 4, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12389
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a leadframe for supporting semiconductor devices and including a plurality of outer lead sections, a recess or recesses are provided on each of the outer lead sections at a central portion or both sides of each outer lead section in a region including a cutting line. The recess or recesses reduce the cross-sectional area of the lead section, thus enabling a new cut surface of the lead section to be well covered by solder and enabling ready cutting of the lead section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.