Adhesive paste containing polymeric resin
US5391604A · kind A · utility
17Cited by
7References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1993 |
| Grant date | Feb 21, 1995 |
| Priority date | — |
| Expiry date | Jul 30, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/092
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive paste of organic polymer resin, inorganic filler and fugitive liquid can be used for die attach applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.