Integrated circuit having reduced soft errors and reduced penetration of alkali impurities into the substrate
US5391915A · kind A · utility
15Cited by
11References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 13, 1993 |
| Grant date | Feb 21, 1995 |
| Priority date | — |
| Expiry date | Dec 13, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device wherein a coating film which is made of a polyimide resin or a polyimide isoindoloquinazolinedione resin and which is at least 10 .mu.m thick is disposed on at least an active region of a semiconductor substrate, and the resultant semiconductor substrate is encapsulated in a ceramic package. The semiconductor device has troubles relieved conspicuously, the troubles being ascribable to alpha-rays which come flying from impurities contained in the material of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.