Plastic package type semiconductor device
US5391924A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 14, 1993 |
| Grant date | Feb 21, 1995 |
| Priority date | — |
| Expiry date | Sep 14, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a plastic package type semiconductor device having a semiconductor element encapsulated with an epoxy resin composition, said resin composition containing as indispensable components (a) an epoxy resin, (b) a curing agent, (c) a curing promotor, (d) a first inorganic powder having an average diameter of 5 to 40 .mu.m and a smooth outer surface substantially free from edges, ridges and projections, and (e) a second inorganic powder having an average diameter of 0.1 to 10 .mu.m and a heat conductivity of at least 4.0 W/m.multidot.K, the mixing amount of the first inorganic powder (d) being 10 to 50% by volume based on the sum of the first inorganic powder (d) and the second inorganic powder (e).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.