Methods and apparatus for snap-together computer construction
US5392192A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1993 |
| Grant date | Feb 21, 1995 |
| Priority date | — |
| Expiry date | Mar 22, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49904
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A modular enclosure for personal computer systems substantially comprises a 5-sided steel chassis, a plastic subassembly tray, a plastic detachable back panel, and a 4-sided plastic top cover including an integrally formed front panel. The internal subassembly tray comprises appropriately formed bays designed to receive various system subassemblies, each bay having an integrally formed subassembly retaining means to bear against and retain a subassembly placed in the bay. Top side and rear electromagnetic interference (EMI) shields are fitted and secured to the interior portions of the plastic topcover and rear panel so as to peripherally contact the chassis when the topcover and rear panel are installed. The internal subassembly tray is lowered into the interior region of the chassis and snapped into place at the front portion thereof. The rear panel is then positioned and secured to the chassis. A plurality of subassemblies, including disk drives and main circuit board may be secured in the subassembly tray and chassis, and interconnected via an appropriately sized subassembly and main cable bundles. Front EMI shields are snapped in place onto the chassis. Tab members disposed in…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.