Boat transport for suporting semiconductor device assemblies
US5392932A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 24, 1992 |
| Grant date | Feb 28, 1995 |
| Priority date | — |
| Expiry date | Dec 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67333
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A boat transport is fabricated to receive either pins-down or pins-up type semiconductor device assemblies, without damaging the pins, and to position the body of the semiconductor device assembly for subsequent packaging processes. The boat transport includes a planar platform for supporting a peripheral portion of the package body. A single large cutout through the platform receives all of the pins of the semiconductor device assembly. Guides which extend downward from the platform along each side (edge) of the cutout prevent lateral and rotational movement of a pins-down package. Other guides, which ascend upward from the platform along each side (edge) of the cut out, prevent pins-up packages from lateral and rotational movement. Additional cutouts through the platform accommodate chip capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.