Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof
US5393705A · kind A · utility
9Cited by
11References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 22, 1994 |
| Grant date | Feb 28, 1995 |
| Priority date | — |
| Expiry date | Feb 22, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded semiconductor device comprises a semiconductor chip mounted on an island portion, and external leads coupled with ball pumps on the semiconductor chip by means of a conductive leads patterned on a film carrier, and the conductive leads are formed from a conductive lattice pattern on the film carrier available for other molded devices by selectively cutting the conductive lattice pattern with, for example, a laser beam generator, thereby reducing the production cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.