Wet-etchable random polyimide copolymer for multichip module applications
US5393864A · kind A · utility
4Cited by
7References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 26, 1993 |
| Grant date | Feb 28, 1995 |
| Priority date | — |
| Expiry date | Apr 26, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4676
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A random polyimide copolymer, based on a rigid dianhydride, a rigid diamine and an additional diamine and/or dianhydride containing one or more flexibilizing linkages. Soft-baked coatings of the poly(amic acid) precursor are readily processed using conventional aqueous base developers, such as tetramethylammonium hydroxide. The polyimide and soft-baked coatings are useful as a dielectric layer In multichip module applications or as a stress buffer coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.