Method of making an instrument panel assembly
US5394602A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 1994 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Jun 13, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49984
- WIPO fieldTransport
- WIPO sectorMechanical engineering
Abstract
The instrument panel assembly is made by initially forming an instrument panel substrate having a door-receiving notch, initially forming a door substrate, and attaching the door substrate to the instrument panel substrate so that the door substrate covers the notch and its sides extend beyond the notch and overlie portions of the instrument panel substrate. A single decorative cover layer is also initially formed. The attached substrates are positioned in a mold in spaced relation to the cover layer, and a foamable material is forced into the space to provide a foam padding for both the instrument panel and the door. The sides of the door substrate overlying the instrument panel substrate are braced to prevent distortion thereof during molding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.