Method of providing low cost heat sink
US5394607A · kind A · utility
22Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 20, 1993 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | May 20, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention disclosed herein is a device and method in which a heat sink (22) is attached to support leads (18) of a leadframe (10) via a welding or mechanical joining technique. The method is performed prior to semiconductor device packaging and is usually performed after the leadframe is etched or stamped, and before it is cut into strips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.