Semiconductor polishing pad
US5394655A · kind A · utility
83Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1993 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Aug 31, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/26
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention is to a polishing pad 14 that has a polishing surface 19 in which portions 17 and 18 of the polishing surface 19 have been removed. The removed areas 17 and 18 are annular rings adjacent an outer 15 and inner 16 edges of the polishing pad 14. The non-polishing surfaces 18 and 19 taper 17a and 18a downward from the polishing surface 19.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.