High placement accuracy wire bonder for joining small closely spaced wiring features
US5395038A · kind A · utility
7Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 25, 1994 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Apr 25, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An automated wire bonding tool for interconnecting circuit pads on microelectronic circuit devices and substrates. A single application of the bonding tool spans both bond sites with the wire being held under the bond tool and gripped at both ends while bonding the wire to both bond sites simultaneously and with high placement accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.