Patent · US Expired

Contact element for SMD printed circuit boards and mounting method

US5395256A · kind A · utility

1Cited by

6References

5Claims

0Family size

Assignee

Esser Sicherheitstechnik GmbH · DE

Inventors

Dieter Niessen · Erkelenz, DE
Heiner Politze · Neuss, DE
Michael D. Buschmann · Montréal, CA
Georg Pollmann · Willich, DE
Mario Pussin · Mönchengladbach, DE
Michael Pastors · Neuss, DE

Key dates

Filing date	Nov 10, 1993
Grant date	Mar 7, 1995
Priority date	—
Expiry date	Nov 10, 2013

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49144
WIPO fieldElectrical machinery, apparatus, energy
WIPO sectorElectrical engineering

Abstract

A contact element suitable for SMD printed circuit boards is made of a flexible blank of sheet metal of approximate C-shaped cross-sectional configuration, with dimensions of a DIL package for SMD integrated circuits. The contact element is provided with bent terminals which are soldered onto respective bonding pads upon the circuit board while the top surface of the contact element is provided for contacting by a resilient external countercontact.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.