Patent · US Expired

Process for depositing layers having high specific electrical conductivity

US5395642A · kind A · utility

8Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 17, 1993
Grant dateMar 7, 1995
Priority date
Expiry dateDec 17, 2013

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/52
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A process for depositing metal-containing layers which have a high specific electrical conductivity, involving the decomposition of organometallic compounds in a hydrogen-containing gas or vapor phase by means of a plasma. The energy density of the plasma is optimized, which involves recording an OES spectrum. It is thus possible to produce, e.g., strongly adhering conductor tracks whose width is less than 50 .mu.m and whose ratio of height to width is greater than 1. Also disclosed are a method for optimizing the deposition of metal-containing layers having a high specific conductivity, and a composite body produced by the process of the invention comprising a polymer substrate and a metal layer deposited thereon.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.