Process for depositing layers having high specific electrical conductivity
US5395642A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 1993 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Dec 17, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/52
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for depositing metal-containing layers which have a high specific electrical conductivity, involving the decomposition of organometallic compounds in a hydrogen-containing gas or vapor phase by means of a plasma. The energy density of the plasma is optimized, which involves recording an OES spectrum. It is thus possible to produce, e.g., strongly adhering conductor tracks whose width is less than 50 .mu.m and whose ratio of height to width is greater than 1. Also disclosed are a method for optimizing the deposition of metal-containing layers having a high specific conductivity, and a composite body produced by the process of the invention comprising a polymer substrate and a metal layer deposited thereon.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.