Method of spiral resist deposition
US5395803A · kind A · utility
33Cited by
9References
7Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 8, 1993 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Sep 8, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of depositing a material upon a substrate is disclosed. A material, such as photoresist, is deposited upon a substrate such as a semiconductor wafer by spinning the substrate and commencing deposition at the edge of the wafer and moving inward in a spiral pattern. The method produces a more uniform coating than hitherto available.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.