Thermally curable mixture containing epoxy and formamide compounds

US5395911A · kind A · utility

Assignee

• Dainippon Ink and Chemicals, Inc. · JP

Inventors

• Rainer B. Frings · Berlin, DE
• Gerwald Grahe · Berlin, DE

Key dates

• Filing date: Jul 19, 1993
• Grant date: Mar 7, 1995
• Expiry date: Jul 19, 2013

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C07C2601/16
• WIPO field: Organic fine chemistry
• WIPO sector: Chemistry

Abstract

A thermally curable mixture contains 10-70% by weight of reactive compounds, 0.05-2% by weight of at least one basic catalyst, and at least one solvent. The reactive compounds are consisting essentially of a first reactive compound and a second reactive compound at a molar ratio between 1:1 and 1:10. The first reactive compound is a formamide selected from the group consisting of hydroxyformamides, di-formamides and polyformamides, and the second reactive compound is at least one compound having an epoxy equivalent between 100 and 800 g KOH per mole epoxy group, selected from a group of aromatic di-glycidylethers and aromatic poly-glycidylethers. The basic catalyst is at least one chemical agent selected from the group consisting of tertiary ammonium salts, tertiary aromatic amines, and tertiary heterocyclic amines. The solvent is at least one chemical compound selected from the group consisting of aliphatic alcohols, ether alcohols, diether, and tertiary amides.