Appliance for attaching heat sink to pin grid array and socket
US5396402A · kind A · utility
55Cited by
17References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 24, 1993 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | May 24, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for attaching a heat sink to a chip having an integrated circuit and a pin grid array socket. The device includes a leaf spring pre-assembled to two plastic clips, each of the plastic clips containing a portion which is adapted to extend below the socket, thereby releasably securing the heat sink to the chip and the socket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.