Heat sinking assembly for electrical components
US5396404A · kind A · utility
28Cited by
11References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 1993 |
| Grant date | Mar 7, 1995 |
| Priority date | — |
| Expiry date | Sep 20, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly for dissipating thermal energy from a heat generating electrical components wherein the heat sinking includes a component support member and a cover which surrounds and clamps the electric component to the heat sink and a method of heat sinking where the parts are not heat sunk until the cover is attached to the circuit board. The clamping force for the electrical component may also be varied for optimum heat transfer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.