Cooling apparatus for electronic and computer components
US5396775A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 9, 1993 |
| Grant date | Mar 14, 1995 |
| Priority date | — |
| Expiry date | Nov 9, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Apparatus for cooling components or subassemblies of equipment at one or more locations comprises a first reactor located at a remote location from said equipment, and a second reactor located in heat exchange communication with a component or subassembly of said equipment, each of said first or second reactors containing a different complex compound of a polar refrigerant and a metal salt, wherein the equilibrium temperature of the complex compound in said first reactor differs from the equilibrium temperature of the complex compound in said second reactor by between about 10.degree. C. and about 150.degree. C. at the same operating pressure, heating means for heating a complex compound in said first reactor, and conduit means for directing polar refrigerant between said reactors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.