Method of bonding tungsten titanium sputter targets to titanium plates and target assemblies produced thereby
US5397050A · kind A · utility
50Cited by
7References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 27, 1993 |
| Grant date | Mar 14, 1995 |
| Priority date | — |
| Expiry date | Oct 27, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C14/3407
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A method of producing a sputter target assembly including a tungsten-titanium target attached to a titanium backing plate. The method includes consolidating a tungsten-titanium powder composition to form a target while simultaneously bonding the powder composition to the titanium backing plate to form an interdiffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high temperature operating capability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.