Semiconductor apparatus covered with a sealing resin composition
US5397401A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 28, 1993 |
| Grant date | Mar 14, 1995 |
| Priority date | — |
| Expiry date | Jun 28, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sealing material exhibiting excellent sealing performance while keeping a satisfactory balance between a variety of characteristics is provided so that the sealing structure is simplified and the quantity of the sealing material is reduced. As a result, a solar cell, the cost of which can significantly be reduced and which can be operated stably for a long time while exhibiting excellent performance can be provided. A suitable resin composition for sealing contains at least a hardening resin and a thermoplastic resin which has a number average molecular weight larger than the number average molecular weight of the hardening resin and which is soluble in the hardening resin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.