Thermosetting imide oligomer and manufacturing method of heat resistant laminated sheet using the same
US5397419A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 23, 1993 |
| Grant date | Mar 14, 1995 |
| Priority date | — |
| Expiry date | Apr 23, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention discloses a thermosetting imide oligomer represented by the general formula (1A) or (1B): ##STR1## Where Ar.sub.1 indicates a tetravalent aromatic group, Ar.sub.2 indicates a divalent aromatic group, Ar.sub.1 or Ar.sub.2 can be of the same or different kind, X indicates a trivalent group and it can be of the same or different kind, n is an integer selected from 1 to 15, and R is a substitution group having reactivity. The invention further discloses a method for manufacturing a heat resistant laminated sheet using the imide oligomer, which is excellent in heat resistance, hygroscopic resistance and electric properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.