Heat-resistant laminate materials and preparation thereof
US5397847A · kind A · utility
13Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1993 |
| Grant date | Mar 14, 1995 |
| Priority date | — |
| Expiry date | Jul 15, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0346
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This invention relates to heat-resistant polyimide blends and laminates thereof, which have excellent heat and moisture resistance, and excellent mechanical properties, including outstanding toughness. The blends contain a thermoplastic polyimide component and a thermosetting imide oligomer. The weight ratio of the thermoplastic component to thermosetting component is selected in the range of 99/1 to 5/95. The thermoplastic polyimide component has a number average molecular weight of 10,000 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.