Microelectronic package comprising metal housing grounded to board edge
US5398169A · kind A · utility
12Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 1994 |
| Grant date | Mar 14, 1995 |
| Priority date | — |
| Expiry date | Jan 3, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S174/34
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectronic package (10) comprises a printed circuit board (12) enclosed within a metal housing (14) for shielding the board from spurious electromagnetic signals. The housing includes a base (30) having side walls (36). A series of first tabs (42) are formed in the side walls and engage the upper face (16) of the printed circuit board to secure the board within the housing. The side walls also include a series of second tabs (46) that engage the edge (20) of the printed circuit board in contact with the ground plane to enhance grounding of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.