Method of fabricating conductive structures on substrates
US5399239A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 18, 1992 |
| Grant date | Mar 21, 1995 |
| Priority date | — |
| Expiry date | Dec 18, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1388
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention is an integrated heat sink module and a method of fabricating conductive structures on a substrate. The method of the present invention includes cleaning a substrate material to remove any impurities present on the substrate surface. The method further includes placing a protective layer resilient to chemicals used in conductive structure formation, on a first surface. The first surface is opposite a second surface on which conductive structures are formed. The method includes forming conductive structures on the second surface of the substrate. The protective layer is then removed from the first surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.