Method of applying opaque coatings
US5399441A · kind A · utility
74Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 1994 |
| Grant date | Mar 21, 1995 |
| Priority date | — |
| Expiry date | Apr 12, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of forming opaque coatings on integrated circuits. The method comprises selectively applying a coating of a silica precursor resin and a filler onto the integrated circuit and heating the coated circuit at a temperature sufficient to convert the silica precursor resin to a silica containing ceramic matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.