Method of testing continuity of a connection between an integrated circuit and a printed circuit board by current probing integrated circuit
US5399975A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1993 |
| Grant date | Mar 21, 1995 |
| Priority date | — |
| Expiry date | Jun 1, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/70
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing the electrical conductivity of a connection between an integrated circuit device (9) and a circuit board (7) to which the device (9) is connected. The device (9) includes a current path between a further connection (13) thereto and the connection (15) to be tested. The method comprises the steps of, while the circuit is inoperative: applying via the board (8) a potential of a first amount to the further connection (13); applying via the board (7) a potential of a second different amount to the connection (15) being tested; and positioning a probe adjacent the device (9) to sense indirectly current in the current path, the presence of current indicating that the connection (15) being tested is conductive.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.