Method of manufacturing metallized connector block
US5400504A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 1993 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | May 17, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4922
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A completely shielded metallized connector block for use in multiple circuit modules of an electronic device. Electrical communication between the circuit boards is effected by an array of metallic pins which run through the blocks. The metallization on the nonconductive blocks can be held at ground or at a constant potential to increase the shielding between pins as well as maintaining voltage and ground planes at constant levels throughout the modules. The metallization is insulated from the pins and circuit boards by nonconductive bushings inserted in holes in the blocks. In one embodiment, the metallization consists of copper and solder plating and the blocks are constructed of liquid crystal polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.