Patent · US Expired

Process for manufacturing semiconductor wafers having deformation ground in a defined way

US5400548A · kind A · utility

21Cited by

5References

4Claims

0Family size

Assignee

Wacker-Chemitronic Gesellschaft fur Elektronik Grundstoffe mbH · DE

Inventors

Anton Huber · Burghausen, DE
Karl-Heinz Langsdorf · Burghausen, DE

Key dates

Filing date	Jul 7, 1993
Grant date	Mar 28, 1995
Priority date	—
Expiry date	Jul 7, 2013

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S438/959
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A process for manufacturing semiconductor wafers having deformation ground in a defined way.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.