Circuit board for high pin count surface mount pin grid arrays
US5400948A · kind A · utility
28Cited by
8References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 2, 1994 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Feb 2, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for fabricating a printed circuit board for high pin count surface mount pin grid arrays is provided where surface mount pads for soldering a surface mount pin grid array package are isolated by solder mask layers. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.