Method for packaging hot melt adhesives
US5401455A · kind A · utility
29Cited by
21References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1994 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Aug 25, 2014 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B63/08
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A non-blocking hot melt adhesive mass is prepared by (a) lining a rigid mold with a plastic film, said film being meltable together with the adhesive composition and blendable into said molten adhesive composition, and said mold being a heat sink or being in contact with a heat sink; (b) pouring molten hot melt adhesive into the lined mold; and (c) allowing the molten hot melt adhesive to solidify.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.