Positive-type photosensitive resin compositions with quinone diazide sulfonyl unit
US5401604A · kind A · utility
5Cited by
2References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1994 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Jan 31, 2014 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/164
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A positive-type photosensitive resin composition containing a resin which results from reactions between a specific polyepoxide compound, a carboxylic acid compound having a specific phenolic hydroxyl group, a carboxylic acid compound having no specific phenolic hydroxyl group, and 1,2-quinone diazide sulfonyl halide. The resin composition has high exposure sensitivity, is capable of inhibiting swell or dissolution of unexposed areas during the stage of development, and yet retains other favorable properties. The resin composition has also attained short developing time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.