Printed circuit board with locally enhanced wiring density
US5401909A · kind A · utility
12Cited by
2References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1993 |
| Grant date | Mar 28, 1995 |
| Priority date | — |
| Expiry date | Nov 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/107
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board and a method for making same is disclosed whereby a very high wiring density is provided in those regions of the printed circuit board in which external components (e.g., semiconductor chips) are to be attached directly. An automated registration routine permits very precise registration and positioning in those regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.